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Solder paste 889 NoClean, lead free, halogeneous-free
Qualitek developed a singular fluxing agent system particularly for the higher temperature distributions of lead free alloys. It is thermally stable and prevented effectively thermal decomposition features with the Reflow under normal air atmosphere. Since no nitrogen is needed for the soldering process, the employment of the 889 flux lowers the costs. Additionally the flux 889 has a exzellentes wetting behavior, a outstanding pressure definition and a very long bonding time. The arrears after the soldering process are not corrosive and high not conductive, isolating.
Solder paste 818AT NoClean, Sn63 anti tombstoning
818AT is a arrears-poor flux which for SMT and other applications of electronics was developed. The singular characteristics of this flux offer a exzellente activity, long template service lives, a high sticking strength, high-speed pressure and an extended storage time. The arrears are not corrosively and only weakly sticky transparency.
Solder paste 878 NoClean, lead free, halogeneous-free
The type 878 was developed particularly for the increased requirement with BGA- and CSP layout and is characterised by a exzellentes print format as well as an outstanding Konturenstabilitaaet during the entire process. The arrears after the soldering process are not corrosive and high leading, not isolating.
physical and chemical characteristics |
Solder paste 889 |
Solder paste 818AT |
Solder paste 878 |
| Color and appearance |
metallically grey |
metallically grey |
metallically grey |
Fluxing agent classification
Acid value |
Rol 0
113 |
Rel 0
1.2.3.C |
Rol 0
113 |
| Copper-reflected |
existed |
existed |
existed |
| Silberchromatpapiertest |
no discoloration |
existed |
no discoloration |
| Softening point |
|
125°C |
|
Surfaces insulation resistance
Bellcore
J-STD_004
|
6,12 x 10(11) Ohm
7,88 x 10(11) Ohm
|
4,12 x 10(12) Ohm
(4 days, 35°C, 85% r.H.)
9,80 x 10(12) Ohm
(7 days, 85°C, 85% r.H.) |
6,12 x 10(11) Ohm
7,88 x 10(11) Ohm
|
pH-5% aqueous solution
(Flux Extract) |
|
3,0 -5,0 |
|
| Fluxing agent arrears after Reflow |
45% |
|
45% |
| Electrical migration, Bellcore |
existed |
existed |
existed |
Viscosity:
Malcolm, poise
Brookfield
|
1600 - 2100
900 kcps +/- 10% |
140 - 200kcps, 90% Metal, Type of powder 3
900kcps +/- 10%, 90% Metal, Type of powder 3 |
1600 - 2100
900 kcps +/- 10% |
| Bonding time |
|
48 hours
(22°C, 45% r.H.) |
|
Sticking strength
First measurement
After 24 hours
After 72 hours
Template service life
|
95g
120g
117g
>8 hours
|
100,2g (1,63g/mm²)
95,6g (2,07g/mm²)
|
95g
120g
117g
>8 hours
|
| Durability unopened |
9 months from manufacturing day |
to 9 months from manufacturing day |
9 months from manufacturing day |
| Recommended storage temperature |
4 - 10°C |
2 - 10°C |
4 - 10°C |
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